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Statements

Subject Item
dbr:Land_grid_array
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Land grid array
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The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board.
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dbt:Refimprove dbt:Semiconductor_packages dbt:Reflist dbt:Short_description
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dbc:Chip_carriers
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dbr:Packaging
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dbr:Opteron dbr:LGA_775 dbr:Hewlett-Packard dbr:Pentium dbr:Intel_X299 dbr:Pentium_D dbr:Kaby_Lake dbr:LGA_3647 dbr:Xeon dbr:LGA_4189 dbr:R10000 dbr:Surface-mount_technology dbr:CPU_socket dbr:Intel_X99 dbr:Socket_G34 n8:Intel_CPU_Pentium_4_640_Prescott_bottom.jpg n8:Prozessormontage_LGA_1155_imgp2112_smial_wp.webm dbc:Chip_carriers dbr:Printed_circuit_board dbr:Socket_SP3 dbr:Socket_TR4 dbr:Intel_C612 dbr:Intel dbr:PA-8000 dbr:Skylake_(microarchitecture) dbr:Socket_sTRX4 dbr:List_of_Intel_Core_i7_processors dbr:Ball_grid_array n8:Sockel_775.jpg dbr:Epyc dbr:Chip_carrier dbr:Haswell_(microarchitecture) dbr:Coffee_Lake dbr:Soldering dbr:Pin_grid_array dbr:Intel_Core dbr:MIPS_architecture dbr:LGA_1150 dbr:LGA_1151 dbr:Broadwell_(microarchitecture) dbr:LGA_1155 dbr:UltraSPARC_II dbr:Advanced_Micro_Devices dbr:Socket_AM5 dbr:Intel_Core_2 dbr:LGA_1356 dbr:LGA_1366 dbr:LGA_1156 dbr:Integrated_circuit dbr:LGA_1200 dbr:Sun_Microsystems dbr:LGA_2066 dbr:Socket_C32 dbr:Motherboard dbr:LGA_1700 dbr:Socket_F dbr:Alder_Lake_(microprocessor) dbr:LGA_2011 dbr:Dual_in-line_package dbr:Pentium_4 dbr:LGA_771
dbo:abstract
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board.
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n7:Land_grid_array