About: Ball grid array

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.

Attributes	Values
rdf:type	company
rdfs:label	Ball grid array (en)
rdfs:comment	A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. (en)
sameAs	Ball grid array Ball grid array
dbp:wikiPageUsesTemplate	dbt:Citation_needed dbt:Cn dbt:Div_col dbt:Div_col_end dbt:More_citations_needed dbt:Reflist dbt:Short_description dbt:When dbt:Wikibooks dbt:Semiconductor_packages
Subject	Chip carriers
Link from a Wikipage to an external page	https://amkor.com/packaging/laminate/pbga/ https://c44f5d406df450f4a66b-1b94a87d576253d9446df0a9ca62e142.ssl.cf2.rackcdn.com/2015/03/PBGA-J-Devices-DSJD401.pdf
thumbnail	wiki-commons:Special:FilePath/Solder_ball_grid.jpg?width=300
foaf:depiction
gold:hypernym	Packaging
prov:wasDerivedFrom	http://en.wikipedia.org/wiki/Ball_grid_array?oldid=1071237582&ns=0
Wikipage page ID	231291 (xsd:integer)
page length (characters) of wiki page	16134 (xsd:nonNegativeInteger)
Wikipage revision ID	1071237582 (xsd:integer)
Link from a Wikipage to another Wikipage	Flip chip Grid plan Printed circuit board Small outline integrated circuit X-ray Altera Amkor Technology Whisker (metallurgy) Boundary scan Chip carriers Electronic component distributors Celeron Do it yourself Dual in-line package Maker culture Package on a package Pad cratering Pick-and-place machine Pin grid array Quad flat package Surface-mount technology Surface tension Zero insertion force Chip carrier Dye Dye-and-pry Microprocessor Original equipment manufacturer Restriction of Hazardous Substances Directive Rework (electronics) Socket M Solder ball Solder mask Embedded wafer level ball grid array Flat no-leads package Pentium II Pentium III System on a chip Head-in-pillow defect Heat gun Inductance Industrial computed tomography Infrared heater Integrated circuit Interposer Stiffness JEDEC JTAG Land grid array Multi-chip module Reflow oven Thermal expansion Thermal resistance Thermocouple
has abstract	A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. (en)
foaf:isPrimaryTopicOf	http://en.wikipedia.org/wiki/Ball_grid_array
is Wikipage redirect of	Ball Grid Array Dye & pry Dye and pry FBGA BGA1 BGA2 Bga mount Ceramic ball grid array EBGA PBGA

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